7390
Epoxy Encapsulant
Kisling's 7390 is a solvent-free potting epoxy resin for application in electronic industries. The resin provides good heat resistance as well as good mechanical properties. After curing, the resin shows a dry, non-sticking surface. Best adhesion is given to metals, ceramics and hard plastics.
Spezifikationen
| Eigenschaften | Bedingung |
|---|---|
| Produktkategorie | Epoxy potting compounds |
| Chemische Basis | Epoxy |
| Farbe | colourless (after cure) |
| Dichte [g/cm3] | 1.13 (Mix) |
| Mischungsverhältnis | 100 : 25 (W:W) |
| Viskosität [mPas] | 450 - 550 (Mix) |
| Topfzeit [min] | 45 |
| Endfestigkeit [h] | <16 (bei 40°C) |
| Shore Härte (DIN EN ISO 868) | D85 |
| Temperatureinsatzbereich [°C] | -40 – +180 |
| Gebinde Grossgebinde auf Anfrage | 1 kg |
| Aushärtebedingungen | cold curing |
| Wärmeleitfähigkeit [W/mK] | 0.2 W/mK |
| Glasübergangstemperatur [°C] | 97 |
| CTE < Tg [ppm/K] | 50 |
| CTE > Tg [ppm/K] | 80 |
