Bonding +
Sealing +
Encapsulation

Search form
 

Regular search

Rules

Only words with 2 or more characters are accepted
Max 200 chars total
Space is used to split words, "" can be used to search for a whole string (not indexed search then)
AND, OR and NOT are prefix words, overruling the default operator
+/|/- equals AND, OR and NOT as operators.
All search words are converted to lowercase.

8702

Polyurethane (1K Paste)

Silicone- and solvent-free heat-conducting paste, high-perfomance and electrically insulating, CMR-free*, excellent thermal conductivity, no metallic fillers, high-long-term stability, good creeping properties, ideal for different cooling applications, improves the heat-transfer.

* not required to be labelled CMR according to section 2 of the MSDS

 

Specifications

CharacteristicsCondition
Product categoryPolyurethane (1K Paste)
Chemical base1K Paste
Colornatural (cream)
Density [g/cm3]2.20 – 2.50
Viscosity [mPas]150 000 – 200 000
Temperature range [°C]-60 – +200
Thermal conductivity [W/mK]2.0

Safety data sheet

CountrySwitzerlandEU
LanguageGermanFrenchItalianGermanEnglishFrenchItalian
–
–
–
–
–
–
–
–
–
–
–
–
–
–

Technical information

GermanEnglish
Technical data sheet
–
–
Instructions for use
–
–

More information

GermanEnglish
Focus Flyer E-Mobility
–
–
–
–
Overview Encapsulants
–
–
–
–
Overview Brochure
–
–
–
–

 

contact us

 

Headquarter | Production of adhesives and sealants
Kisling AG
Motorenstrasse 102
CH-8620 Wetzikon
Tel +41 58 272 01 01
info(at)kisling.com

Production of encapsulants
Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
Mail address: Waldstraße 15
DE-71139 Ehningen
P +49 7940 50961 61
info(at)kisling.com

Private Label
Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
Mail address: Zeilbaumweg 15
DE-74613 Öhringen
P +49 7940 50961 60
info(at)kisling.com