Bonding +
Sealing +
Encapsulation

Search form
 

Regular search

Rules

Only words with 2 or more characters are accepted
Max 200 chars total
Space is used to split words, "" can be used to search for a whole string (not indexed search then)
AND, OR and NOT are prefix words, overruling the default operator
+/|/- equals AND, OR and NOT as operators.
All search words are converted to lowercase.

8702

silicone- and solvent-free heat-conducting paste, high-perfomance and electrically insulating, CMR-free, excellent thermal conductivity, no metallic fillers, high-long-term stability, good creeping properties, ideal for different cooling applications, improves the heat-transfer

 

Specifications

CharacteristicsCondition
Product categoryEncapsulants
Chemical base1K Paste
Colornatural (cream)
Density [g/cm3]2.20 – 2.50
Mixing ratio–
Viscosity [mPas]150 000 – 200 000
Pot life [min]–
Shore hardness
(DIN EN ISO 868)		–
Temperature range [°C]-60 – +200
Curing conditions–
Thermal conductivity [W/mK]2.0
Glass transition temperature [°C]–
CTE < Tg [ppm/K]–
CTE > Tg [ppm/K]–
UL94–

Safety data sheet

CountrySwitzerlandGermanyFranceItaly
LanguageGermanEnglishFrenchItalianGermanEnglishFrenchItalian
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–
–

Technical information

GermanEnglish
Technical data sheet
–
–
Instructions for use
–
–

More information

GermanEnglish
Focus Flyer E-Mobility
–
–
–
–
Overview Encapsulants
–
–
–
–
Overview Brochure
–
–
–
–

 

contact us

 

Kisling AG
Motorenstrasse 102
CH-8620 Wetzikon
Tel +41 58 272 01 01
info(at)kisling.com

Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
Mail address: Waldstraße 15
DE-71139 Ehningen
P +49 7940 50961 61
info(at)kisling.com