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7611

Epoxy Encapsulant

7611 is a black, fast curing, unfilled epoxy potting compound. The product is most appropriate for potting of smaller volumes such as for cables, connectors, plugs, sensors in the electronic market. CMR-free*

*not required to be labelled CMR according to section 2 of the MSDS

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Specifications

CharacteristicsCondition
Product categoryEncapsulants
Chemical baseEpoxy
Colorblack
Density [g/cm3]1.15
Mixing ratio100 : 96.2 (Vol)
Viscosity [mPas]8 000 – 11 000
Pot life [min]3.5
Shore hardness
(DIN EN ISO 868)		D75
Temperature range [°C]-60 – +100
Curing conditionscold curing
Thermal conductivity [W/mK]0.2
Glass transition temperature [°C]52
CTE < Tg [ppm/K]52
CTE > Tg [ppm/K]215

More information

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Overview Encapsulants
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Contact us

Formular Produkteinzelseiten

Formular Produkteinzelseiten

Headquarter | Production of adhesives and sealants
Kisling AG
Motorenstrasse 102
CH-8620 Wetzikon
P +41 58 272 01 01
info(at)kisling.com

Kisling Deutschland GmbH
Salzstraße 15
74676 Niedernhall
P +49 7940 50961 61
info(at)kisling.com

Encapsulants
P +49 7940 50961 61

Adhesives and sealants
P +49 7940 50961 62

Private Label
P +49 7940 50961 60