- Products
- Product overview
- 7611 Epoxy Potting Compound
7611
Epoxy Encapsulant
7611 is a black, fast curing, unfilled epoxy potting compound. The product is most appropriate for potting of smaller volumes such as for cables, connectors, plugs, sensors in the electronic market. CMR-free*
*not required to be labelled CMR according to section 2 of the MSDS
Spezifikationen
| Eigenschaften | Bedingung |
|---|---|
| Produktkategorie | Encapsulants |
| Chemische Basis | Epoxy |
| Farbe | black |
| Dichte [g/cm3] | 1.15 |
| Mischungsverhältnis | 100 : 96.2 (Vol) |
| Viskosität [mPas] | 8 000 – 11 000 |
| Topfzeit [min] | 3.5 |
| Shore Härte (DIN EN ISO 868) | D75 |
| Temperatureinsatzbereich [°C] | -60 – +100 |
| Aushärtebedingungen | cold curing |
| Wärmeleitfähigkeit [W/mK] | 0.2 |
| Glasübergangstemperatur [°C] | 52 |
| CTE < Tg [ppm/K] | 52 |
| CTE > Tg [ppm/K] | 215 |

