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- 8701 1 component thermal paste
8701
1 component heat-conducting paste
Silicone- and solvent-free heat-conducting paste, 1 component, CMR-free*, high-performance and electrically insulating, excellent thermal conductivity, no metallic fillers, high-long-term stability, good creeping properties, ideal for different cooling applications, improves the heat-transfer.
* not required to be labelled CMR according to section 2 of the MSDS
Spezifikationen
| Eigenschaften | Bedingung |
|---|---|
| Produktkategorie | 1K Paste |
| Farbe | natur (cream) or on request |
| Dichte [g/cm3] | 2.25 – 2.55 |
| Viskosität [mPas] | 100 000 – 150 000 |
| Temperatureinsatzbereich [°C] | -60 – +140 |
| Wärmeleitfähigkeit [W/mK] | 1.2 |
