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- 8702 1 component heat conducting paste
8702
1K heat conducting paste
Silicone- and solvent-free heat-conducting paste, high-perfomance and electrically insulating, CMR-free*, excellent thermal conductivity, no metallic fillers, high-long-term stability, good creeping properties, ideal for different cooling applications, improves the heat-transfer.
* not required to be labelled CMR according to section 2 of the MSDS
Spezifikationen
| Eigenschaften | Bedingung |
|---|---|
| Produktkategorie | 1K Paste |
| Farbe | natural (cream) |
| Dichte [g/cm3] | 2.20 – 2.50 |
| Viskosität [mPas] | 130 000 – 175 000 |
| Temperatureinsatzbereich [°C] | -60 – +200 |
| Wärmeleitfähigkeit [W/mK] | 2.0 |
Weitere Informationen
| Deutsch | Englisch | |||
|---|---|---|---|---|
| Focus Flyer E-Mobility | – | – | – | – |
| Overview Encapsulants | – | – | – | – |
| Overview Brochure | – | – | – | – |
