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Epoxy Encapsulant

2-components epoxy casting resin, solvent-free system, no halogenated flame-retardants, thermal conductivity of 1.2 W/(m•K), self-extinguishing properties, electrically insulating, high chemical resistance, ideal for potting of electrical motors and power electronics, CMR-free*

 

* not required to be labelled CMR according to section 2 of the MSDS

Specifications

CharacteristicsCondition
Product categoryEncapsulants
Chemical baseEpoxy
Colorblack
Density [g/cm3]1.75
Mixing ratio100 : 6.7 (W:W)
Viscosity [mPas]7 000 – 8 000
Pot life [min]~ 80
Shore hardness
(DIN EN ISO 868)
D86
Temperature range [°C]-40 – +180
Curing conditionscold curing
Thermal conductivity [W/mK]1.2
Glass transition temperature [°C]52
CTE < Tg [ppm/K]26
CTE > Tg [ppm/K]122
UL94V-0 4.0 mm

Safety data sheet

CountrySwitzerlandEU
LanguageGermanFrenchItalianGermanEnglishFrenchItalian
Resin
Hardener

Technical information

GermanEnglish
Technical data sheet
Instructions for use

More information

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Focus Flyer Electronics
Overview Encapsulants
Overview Brochure

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