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- 7501 + 7920 Epoxy Encapsulant
7501 + 7920
Epoxy Encapsulant
2-components epoxy casting resin, solvent-free system, no halogenated flame-retardants, thermal conductivity of 1.2 W/(m•K), self-extinguishing properties, electrically insulating, high chemical resistance, ideal for potting of electrical motors and power electronics, CMR-free*
* not required to be labelled CMR according to section 2 of the MSDS
Spezifikationen
| Eigenschaften | Bedingung |
|---|---|
| Produktkategorie | Encapsulants |
| Chemische Basis | Epoxy |
| Farbe | black |
| Dichte [g/cm3] | 1.75 |
| Mischungsverhältnis | 100 : 6.7 (W:W) |
| Viskosität [mPas] | 7 000 – 8 000 |
| Topfzeit [min] | ~ 80 |
| Shore Härte (DIN EN ISO 868) | D86 |
| Temperatureinsatzbereich [°C] | -40 – +180 |
| Aushärtebedingungen | cold curing |
| Wärmeleitfähigkeit [W/mK] | 1.2 |
| Glasübergangstemperatur [°C] | 52 |
| CTE < Tg [ppm/K] | 26 |
| CTE > Tg [ppm/K] | 122 |
| UL94 | V-0 4.0 mm |
Weitere Informationen
| Deutsch | Englisch | |||
|---|---|---|---|---|
| Focus Flyer Electronics | – | – | – | – |
| Overview Encapsulants | – | – | – | – |
| Overview Brochure | – | – | – | – |
